LG Chem Starts Developing MR-MUF Material for HBM Chips

Two processes, two customer groups

Samsung Electronics and Micron place NCF in film form and bond the chips with heat and pressure. LG Chem has developed its NCF with its own technology and is running evaluations with major customers. It is reportedly making notable technical progress and has received good assessment results.

SK hynix takes a different route. It stacks the chips first, bonds the electrodes in one step, then injects a liquid protective material and cures it. That is the MR-MUF process, and the liquid MUF LG Chem is developing is tailored to it. With NCF aimed at Samsung and Micron and MUF at SK hynix and other potential customers, LG Chem could serve both process types.

Supply chain implications

The NCF Samsung uses comes mainly from Japan's Resonac, while SK hynix's MR-MUF material is supplied by Japan's Namics. If LG Chem succeeds, HBM makers could lower their dependence on Japanese products and diversify supply. LG Chem is expected to go through performance evaluation and reliability verification matched to each customer's process.

"Korean chipmakers lead HBM manufacturing, but most of the key materials supply chain depends on overseas suppliers," an industry official said. Successful mass production of both NCF and MR-MUF materials, the official added, would be a chance to strengthen the domestic supply chain.